Abstract
Cu and graphene-coated Cu substrates spread with Sn-Zn eutectic-based alloy containing 0.5 wt.%, 1 wt.%, or 1.5 wt.% Cu have been studied at 250°C. Soldering experiments were performed for wetting time of 3 min, 8 min, 15 min, 30 min, and 60 min in (1) presence of flux without argon protective atmosphere and (2) fluxless in argon atmosphere. Solidified solder–pad couples were cross-sectioned and examined using scanning electron microscopy with energy-dispersive spectroscopy to study their interfacial microstructure. To assess the effect of graphene coating on solder, Cu pads were covered by graphene using chemical vapor deposition. The results revealed that the liquid solder did not wet the graphene-coated copper in the absence of flux. Wetting took place only with use of flux, because it destroyed the graphene layer and enabled contact of the liquid solder with the copper. Experiments were designed to demonstrate the effect of Cu addition and graphene coating on the kinetics of the formation and growth of Cu5Zn8 and CuZn4 phases identified by x-ray diffraction analysis, Raman spectroscopy, and energy-dispersive spectroscopy. A decrease of about 60% in the thickness of the intermetallic layer was observed when applying the graphene interlayer in presence of flux. Addition of copper to the Sn-Zn alloy improved the wettability as the copper content was increased.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
P.T. Vianco and R.A. Rejent, J. Electron. Mater. 28, 1127 (1999).
S. Ganesan and M. Pecht, Lead-Free Electronics (New York: Wiley-Interscience, 2006).
Z. Moser, W. Gasior, J. Pstruś, and A. Debski, Int. J. Thermophys. 29, 1974 (2008).
R. Kisiel, W. Gąsior, Z. Moser, J. Pstruś, K. Bukat, and J. Sitek, J. Phase Equilib. Diffus. 25, 122 (2004).
M.D.A. Shnawah, M.F.M. Sabri, and I.A. Badruddinrials, Microelectron. Reliab. 52, 90 (2012).
S. Vaynman, G. Ghosh, and M.E. Fine, Mater. Trans. 45, 630 (2004).
J. Villain, W. Jillck, E. Schmitt, and T. Qasim, Properties and reliability of SnZn-based lead-free solder alloys, in Proceedings of the 2004 International IEEE Conference on the Asian Green Electronics, AGEC (IEEE Cat. No. 04EX769), pp. 38–41 (2004).
M. Grobelny and N. Sobczak, J. Mater. Eng. Perform. 21, 614 (2012).
D.Q. Yu, H.P. Xie, and L. Wang, J. Alloys Compd. 385, 119 (2004).
M.I. Huang, Y.Z. Huang, H.T. Ma, and J. Zhao, J. Electron. Mater. 40, 315 (2011).
J. Pstruś, P. Fima, and T. Gancarz, J. Mater. Eng. Perform. 21, 606 (2012).
R.W. Wu, L. Tsao, and R.S. Chen, J. Mater. Sci. Mater. Electron. 26, 1858 (2015).
L. Zhang, S. Xue, L. Gao, Z. Sheng, and H. Ye, J. Mater. Sci. Mater. Electron. 21, 1 (2010).
Y.C. Chan, M.Y. Chiu, and T.H. Chuang, Z. Metallkd. 93, 95 (2002).
S.V. Morozov, K.S. Novoselov, M.I. Katsnelson, F. Schedin, D.C. Elias, and J.A. Jaszczak, Phys. Rev. Lett. 100, 016602 (2008).
K.S. Kim, Y. Zhao, H. Jang, S.Y. Lee, J.M. Kim, K.S. Kim, J.-H. Ahn, P. Kim, J.-Y. Choi, and B.H. Hong, Nature 457, 706 (2009).
S. Bae, H. Kim, Y. Lee, X. Xu, J.-S. Park, Y. Zheng, J. Balakrishnan, T. Lei, H.R. Kim, and Y.I. Song, Nat. Nanotechnol. 5, 574 (2010).
T. Sun, Z. Wang, Z. Shi, G. Ran, W. Xu, Z. Wang, Y. Li, L. Dai, and G. Qin, Appl. Phys. Lett. 96, 133301 (2010).
F. Bonaccorso, Z. Sun, T. Hasan, and A.C. Ferrari, Nat. Photonics 4, 611 (2010).
F.N. Xia, D.B. Farmer, Y.M. Lin, and P. Avouris, Nano Lett. 10, 715 (2010).
X. Hua, Y.C. Chan, K. Zhan, and K.C. Yung, J. Alloys Compd. 580, 162 (2013).
R. Asthana, M. Singh, and N. Sobczak, J. Mater. Sci. 45, 4276 (2010).
J. Rafiee, X. Mi, H. Gullapalli, A.V. Thomas, F. Yavari, Y. Shi, P.M. Ajayan, and N.A. Koratkar, Nat. Mater. 11, 217 (2012).
K. Xu and J.R. Heath, Nat. Mater. 12, 871 (2013).
Y.-H. Ko, J.-D. Lee, T. Yoon, Ch-W Lee, and T.-S. Kim, ACS Appl. Mater. Interfaces 8, 5679 (2016).
K. Suganuma and K. Niihara, J. Mater. Res. 13, 2859 (1998).
P. Fima, J. Pstruś, and T. Gancarz, J. Mater. Eng. Perform. 23, 1530 (2014).
C. Mattevi, H. Kima, and M. Chhowalla, J. Mater. Chem. 21, 3324 (2011).
L.G. Cançado, A. Jorio, E.H.M. Ferreira, F. Stavale, C.A. Achete, R.B. Capaz, M.V.O. Moutinho, A. Lombardo, T.S. Kulmala, and A.C. Ferrari, Nano Lett. 11, 3190 (2011).
Y. Hao, Y. Wang, L. Wang, Z. Ni, Z. Wang, R. Wang, C.K. Koo, Z. Shen, and J.T.L. Thong, Small 6, 195 (2010).
A.C. Ferrari, Solid State Commun. 143, 47 (2007).
J. Wojewoda, P. Zieba, B. Onderka, R. Filipek, and P. Romanow, Arch. Metall. Mater. 51, 345 (2006).
H.M. Lee, S.W. Yoon, and B.J. Lee, J. Electron. Mater. 27, 1161 (1998).
J. Pstrus and T. Gancarz, J. Mater. Eng. Perform. 23, 1614 (2014).
W.S. Wolczynski, T. Okane, C. Senderowski, D. Zasada, B. Kania, and J. Janczak-Rusch, Int. J. Thermodyn. 14, 97 (2011).
Acknowledgements
This work was financed within the framework of the Project POIG.01.01.02-00-015/09 (Advanced materials and their production technologies, ZAMAT), cofunded by the European Regional Development Fund (ERDF) and the Government of Poland under the Innovative Economy Program, and work was financed by IMMS PAS (Z1:Environment friendly technologies and materials).
Open Access
This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Open Access This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
About this article
Cite this article
Pstruś, J., Ozga, P., Gancarz, T. et al. Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate. J. Electron. Mater. 46, 5248–5258 (2017). https://doi.org/10.1007/s11664-017-5529-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-017-5529-2